반도체/패키지 제조 및 신뢰성
지능화 자율/유연제조 시스템
기계 장비 설계
지능화 기전시스템 설계
다물리 시스템 설계 및 해석
학력
(박사) 한국과학기술원 기계공학과 (2015)
(학사) 고려대학교 기계공학과 (2011)
약력/경력
부교수, 2020.01 – 현재, 성균관대학교 기계공학부
VVP 교수, 2025, SK Hynix R&D, WF bonding team
조교수, 2017.09 – 2019.12, 한동대학교 기계제어공학부
책임연구원, 2017.05 - 2017.08, 삼성전자 반도체연구소, 패키지개발팀
연구원, 2016.01 – 2017.05, General Motors R&D U.S.A.
박사후연구원, 2015.09 – 2016.02, 한국과학기술원
학술지 논문
(2026)
Multi-scale computational approach to understand plasma assisted sulfidation for growth mechanism of MoS2.
CHEMICAL ENGINEERING JOURNAL.
527,
1
(2025)
Modeling framework and discussion of microstructural effects on the formation of Cu-Cu bonding interfaces in semiconductor stacking.
INTERNATIONAL JOURNAL OF PLASTICITY.
1,
1
(2025)
Microscale Tin-Bismuth Alloy Prepared via Cooling Rate Control as Anode Material for High-Performance Lithium-Ion Batteries.
ADVANCED FUNCTIONAL MATERIALS.
1,
1
(2025)
Phase-segregated SnSb alloy anode for lithium-ion battery.
JOURNAL OF ELECTROANALYTICAL CHEMISTRY.
996,
1
(2025)
Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model.
IEEE ACCESS.
13,
1
(2025)
Investigation of Plastic Deformation and Electromagnetic Interaction for Copper Losses Caused by Hairpin Motor Manufacturing.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION.
11,
4
(2025)
Integrated modeling framework for the interactions of plastic deformation, magnetic fields, and electrical circuits: Theory and applications to physics-informed real-time material monitoring.
INTERNATIONAL JOURNAL OF PLASTICITY.
184,
1
(2024)
Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging.
INTERNATIONAL JOURNAL OF PLASTICITY.
180,
1
(2024)
Evaluation of Mechanical Properties Considering Uncertainties for Hairpin Coils in Electric Vehicle Motor Manufacturing.
IEEE ACCESS.
12,
1
(2024)
Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs.
APPLIED MATHEMATICAL MODELLING.
130,
22
(2024)
A closed-form expression of a ductile Fracture Limit Surface (FLS) for general plane stress deformation paths.
APPLIED MATHEMATICAL MODELLING.
129,
1
(2024)
Relativistic constitutive modeling of inelastic deformation of continua moving in space-time.
COMMUNICATIONS IN NONLINEAR SCIENCE AND NUMERICAL SIMULATION.
131,
1
(2023)
Correlation between parameters in the microstructural vector theory and Hill's plastic potential.
APPLIED MATHEMATICAL MODELLING.
124,
12
(2023)
Effective thermo-electric-mechanical modeling of capacitively coupled plasma in low-pressure conditions: Modeling and application in dry etching.
APPLIED MATHEMATICAL MODELLING.
127,
1
(2023)
Automation of trimming die design inspection by zigzag process between AI and CAD domains.
ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE.
127,
2
(2023)
Implicit Integration Algorithm for Solving Evolution of Microstructural Vectors Based on Eulerian Formulation in Plane Stress Condition.
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME.
90,
4
(2022)
Application of Convolutional Neural Network to Predict Anisotropic Effective Thermal Conductivity of Semiconductor Package.
IEEE ACCESS.
10,
1
(2022)
A New Approach to Modeling Focused Infrared Heating Based on Quantum Mechanical Formulations.
APPLIED SCIENCES-BASEL.
12,
7
(2022)
Eulerian constitutive equations for the coupled influences of anisotropic yielding, the Bauschinger effect and the strength-differential effect for plane stress.
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES.
241,
111475
(2021)
Plasticity Enzymatic Degradation Coupled With Volumetric Growth in Pulmonary Hypertension Progression.
JOURNAL OF BIOMECHANICAL ENGINEERING-TRANSACTIONS OF THE ASME.
143,
11
특허/프로그램
STAMPED COMPONENT WITH IMPROVED FORMABILITY.
15 / 899438 .
20190822.
미국
수상/공훈
Young researcher award, KSPE, 2024
34회 우수연구수상, 한국과총연합 2024
Young researcher award, ASPEN 2022
IJPEM-GT contribution award, KSPE 2022
Minister of Education award (교육부장관상), 2018, The best lecture of CAE design and analysis