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교수소개

교수소개 -

전임교수

  • 부교수
  • 이은호
    Lab 다물리시스템 및 해석공학 연구실

관심분야

반도체/패키지 제조 및 신뢰성 
지능화 자율/유연제조 시스템
기계 장비 설계
지능화 기전시스템 설계  
다물리 시스템 설계 및 해석 

학력

  • (박사) 한국과학기술원 기계공학과 (2015)
  • (학사) 고려대학교 기계공학과 (2011)

약력/경력

  • 부교수, 2020.01 – 현재, 성균관대학교 기계공학부
  • VVP 교수, 2025, SK Hynix R&D, WF bonding team
  • 조교수, 2017.09 – 2019.12, 한동대학교 기계제어공학부
  • 책임연구원, 2017.05 - 2017.08, 삼성전자 반도체연구소, 패키지개발팀
  • 연구원, 2016.01 – 2017.05, General Motors R&D U.S.A.
  • 박사후연구원, 2015.09 – 2016.02, 한국과학기술원

학술지 논문

  • (2026)  Multi-scale computational approach to understand plasma assisted sulfidation for growth mechanism of MoS2.  CHEMICAL ENGINEERING JOURNAL.  527,  1
  • (2025)  Modeling framework and discussion of microstructural effects on the formation of Cu-Cu bonding interfaces in semiconductor stacking.  INTERNATIONAL JOURNAL OF PLASTICITY.  1,  1
  • (2025)  Microscale Tin-Bismuth Alloy Prepared via Cooling Rate Control as Anode Material for High-Performance Lithium-Ion Batteries.  ADVANCED FUNCTIONAL MATERIALS.  1,  1
  • (2025)  Phase-segregated SnSb alloy anode for lithium-ion battery.  JOURNAL OF ELECTROANALYTICAL CHEMISTRY.  996,  1
  • (2025)  Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model.  IEEE ACCESS.  13,  1
  • (2025)  Investigation of Plastic Deformation and Electromagnetic Interaction for Copper Losses Caused by Hairpin Motor Manufacturing.  IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION.  11,  4
  • (2025)  Integrated modeling framework for the interactions of plastic deformation, magnetic fields, and electrical circuits: Theory and applications to physics-informed real-time material monitoring.  INTERNATIONAL JOURNAL OF PLASTICITY.  184,  1
  • (2024)  Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging.  INTERNATIONAL JOURNAL OF PLASTICITY.  180,  1
  • (2024)  Evaluation of Mechanical Properties Considering Uncertainties for Hairpin Coils in Electric Vehicle Motor Manufacturing.  IEEE ACCESS.  12,  1
  • (2024)  Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs.  APPLIED MATHEMATICAL MODELLING.  130,  22
  • (2024)  A closed-form expression of a ductile Fracture Limit Surface (FLS) for general plane stress deformation paths.  APPLIED MATHEMATICAL MODELLING.  129,  1
  • (2024)  Relativistic constitutive modeling of inelastic deformation of continua moving in space-time.  COMMUNICATIONS IN NONLINEAR SCIENCE AND NUMERICAL SIMULATION.  131,  1
  • (2023)  Correlation between parameters in the microstructural vector theory and Hill's plastic potential.  APPLIED MATHEMATICAL MODELLING.  124,  12
  • (2023)  Effective thermo-electric-mechanical modeling of capacitively coupled plasma in low-pressure conditions: Modeling and application in dry etching.  APPLIED MATHEMATICAL MODELLING.  127,  1
  • (2023)  Automation of trimming die design inspection by zigzag process between AI and CAD domains.  ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE.  127,  2
  • (2023)  Implicit Integration Algorithm for Solving Evolution of Microstructural Vectors Based on Eulerian Formulation in Plane Stress Condition.  JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME.  90,  4
  • (2022)  Application of Convolutional Neural Network to Predict Anisotropic Effective Thermal Conductivity of Semiconductor Package.  IEEE ACCESS.  10,  1
  • (2022)  A New Approach to Modeling Focused Infrared Heating Based on Quantum Mechanical Formulations.  APPLIED SCIENCES-BASEL.  12,  7
  • (2022)  Eulerian constitutive equations for the coupled influences of anisotropic yielding, the Bauschinger effect and the strength-differential effect for plane stress.  INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES.  241,  111475
  • (2021)  Plasticity Enzymatic Degradation Coupled With Volumetric Growth in Pulmonary Hypertension Progression.  JOURNAL OF BIOMECHANICAL ENGINEERING-TRANSACTIONS OF THE ASME.  143,  11

특허/프로그램

  • STAMPED COMPONENT WITH IMPROVED FORMABILITY.  15 / 899438 .  20190822.  미국

수상/공훈

  • Young researcher award, KSPE, 2024
  • 34회 우수연구수상, 한국과총연합 2024
  • Young researcher award, ASPEN 2022
  • IJPEM-GT contribution award, KSPE 2022
  • Minister of Education award (교육부장관상), 2018, The best lecture of CAE design and analysis