(2025)
Etchant-Free Wafer-Scale 2D Transfer and van der Waals 3D Integration via Peel-Off Force Engineering.
ACS NANO.
19,
28
(2025)
Phonon mean free path analysis in polycrystalline nanostructured thin films.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER.
239,
(2024)
Simultaneous determination of the phase boundary thermal resistance and thermal conductivity in phase-separated TiO2 thin films.
ACTA MATERIALIA.
277,
(2024)
Anisotropic and inhomogeneous thermal conductivity of sub-micrometer polycrystalline diamond thin films: A Monte Carlo ray tracing simulation study.
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER.
156,
(2024)
Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap.
Applied Thermal Engineering.
241,
(2023)
Thermal conductivity of yttria-stabilized zirconia thin films grown by plasma-enhanced atomic layer deposition.
JOURNAL OF THE AMERICAN CERAMIC SOCIETY.
106,
9
(2023)
Boosting Thermal Conductivity by Surface Plasmon Polaritons Propagating along a Thin Ti Film.
PHYSICAL REVIEW LETTERS.
130,
17
(2023)
Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond.
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER.
143,
(2022)
Fundamental conduction cooling limits for sub-1 mu m Ga2O3 devices integrated with diamond.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER.
191,
(2021)
High-Temperature Skin Softening Materials Overcoming the Trade-Off between Thermal Conductivity and Thermal Contact Resistance.
SMALL.
17,
38
(2021)
Thermal conductivity of plasma-enhanced atomic layer deposited hafnium zirconium oxide dielectric thin films.
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY.
41,
6
(2020)
The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER.
158,
(2020)
Hierarchically Structured Laser-Induced Graphene for Enhanced Boiling on Flexible Substrates.
ACS APPLIED MATERIALS & INTERFACES.
12,
33
(2019)
Fundamental limits for near-junction conduction cooling of high power GaN-on-diamond devices.
SOLID STATE COMMUNICATIONS.
295,
1
열물성 계측을 위한 듀얼 모드 열반사율 방법 및 시스템.
10-2023-0088091.
20260122.
대한민국
수상/공훈
대한기계학회 열공학 젊은연구자상 (2025)
성공(成工) Young-Fellowship (2024)
젊은공학자상, 한국정밀공학회(KSPE) (2018)
학술회의논문
(2025)
Electro-Thermal Co-Design of High-Power Semiconductor Devices.
The 19th Korea-U.S. Forum on Nanotechnology.
대한민국
(2025)
Nucleate Flow Boiling Enhancement in Copper Inverse Opal-coated Manifold Microchannel.
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
미국
(2025)
Thermal Conductivity Measurements of BeO Thin Films Grown by Plasma Enhanced Atomic Layer Deposition.
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
미국
(2025)
Thermal Conductivity Measurements of CVD-grown h-BN Films.
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
미국
(2025)
Thermal management of GaN HEMTs through electro-thermal modeling.
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
미국
(2025)
Electro-thermal modeling 을 이용한 GaN-on-diamond 전력반도체 소자의 열관리 전략.
대한기계학회 열공학부문 2025년 춘계학술대회.
대한민국
(2025)
플라즈마 강화 원자층 증착 BeO 박막의 열전도도 계측.
대한기계학회 열공학부문 2025년 춘계학술대회.
대한민국
(2025)
초광대역 밴드갭 AlxGa1–xN 반도체 소자의 소자단위 열관리.
대한기계학회 열공학부문 2025년 춘계학술대회.
대한민국
(2024)
Thermal property measurements using thermoreflectance techniques for device and packaging applications.
ISMP-IRSP 2024.
대한민국
(2024)
Thermal Conductivity Modeling of Sub-1 µm Polycrystalline Diamond Thin Films.
The 11th Asia-Pacific Workshop on Widegap Semiconductors (APWS 2024).
대한민국
(2024)
Thermal Conductivity Measurements of BeO Thin Films Grown by Plasma Enhanced Atomic Layer Deposition.
The 11th Asia-Pacific Workshop on Widegap Semiconductors (APWS 2024).
대한민국
(2024)
Thermal Conductivity Measurements of MOCVD-Grown Ga2O3 Heterostructures.
The 11th Asia-Pacific Workshop on Widegap Semiconductors (APWS 2024).
대한민국
(2024)
Thermal Management of GaN-on-Diamond HEMTs through Electro-Thermal Modeling.
The 11th Asia-Pacific Workshop on Widegap Semiconductors (APWS 2024).
대한민국
(2024)
주파수 도메인 열반사율 기법을 이용한 상변화 TiO2 박막의 열 특성 분석.
대한기계학회 열공학부문 2024년 춘계학술대회.
대한민국
(2024)
Phonon Ray Tracing 기반 다이아몬드 박막 열전도도 모델링.
대한기계학회 열공학부문 2024년 춘계학술대회.
대한민국
(2024)
Thermal Property Measurements for Device and Packaging Applications.
2024년 한국마이크로전자 및 패키징학회 정기학술대회.
대한민국
(2023)
Thermal Management of GaN-on-Diamond HEMTs Through Electro-Thermal Modeling.
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2023.
미국
(2023)
Thermal Conductivity Measurement of Gallium Nitride Thin Films Using Thermoreflectance.
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2023.
미국
(2023)
Device-level thermal management of ultra-wide bandgap Ga2O3 electronics.
제6회 한국산화갈륨기술연구회 전문학술워크숍.
대한민국
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